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SM-K26-XCL2GC-ED
SM-K26-XCL2GC-ED

Xilinx (AMD)
Brand
Box
Packaging
Batch
200
Stock
Product specifications
TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesZynq® UltraScale+™ Kria™
PackageBox
Product StatusOBSOLETE
Connector Type2 x 240 Pin
Size / Dimension3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed533MHz, 1.333GHz
RAM Size4GB
Operating Temperature0°C ~ 85°C (TJ)
Module/Board TypeFPGA Core
Core ProcessorARM® Cortex®-A53
Co-ProcessorArm® Cortex®-R5F
Flash Size16GB eMMC, 64MB QSPI
Technical documentation
Product Overview
SOM K26C VISION ZYNQ MPSOC ED
0.155667s