Global leading embedded solution provider
0
%
TDA2SABRQABCRQ1
TDA2SABRQABCRQ1

Texas Instruments
Brand
Tray
Packaging
Batch
200
Stock
Product specifications
TYPEDESCRIPTION
MfrTexas Instruments
Series-
PackageTray
Product StatusACTIVE
Package / Case760-BFBGA, FCBGA
Speed750MHz, 750MHz
RAM Size2.5MB
Number of I/O247
Operating Temperature-40°C ~ 125°C (TJ)
Core ProcessorARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
ConnectivityCANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
PeripheralsDMA, POR, PWM, WDT
Supplier Device Package760-FCBGA (23x23)
ArchitectureDSP, MPU
Technical documentation
Product Overview
SOC PROCESSOR W/ HIGHLY-FEATURED
0.862156s