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TDA2SXBTQABCQ1
TDA2SXBTQABCQ1

Texas Instruments
Brand
Bulk
Packaging
Batch
200
Stock
Product specifications
TYPEDESCRIPTION
MfrTexas Instruments
Series-
PackageBulk
Product StatusACTIVE
Package / Case760-BFBGA, FCBGA
Speed750MHz, 1.18GHz
RAM Size2.5MB
Number of I/O247
Operating Temperature-40°C ~ 125°C (TJ)
Core ProcessorARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
ConnectivityCANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
PeripheralsDMA, POR, PWM, WDT
Supplier Device Package760-FCBGA (23x23)
ArchitectureDSP, MPU
GradeAutomotive
QualificationAEC-Q100
Technical documentation
Product Overview
PROTOTYPE
1.073698s