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TDA3MARBABFRQ1
TDA3MARBABFRQ1

Texas Instruments
Brand
Bulk
Packaging
Batch
200
Stock
Product specifications
TYPEDESCRIPTION
MfrTexas Instruments
Series-
PackageBulk
Product StatusACTIVE
Package / Case367-BFBGA, FCBGA
Speed212.8MHz, 745MHz
RAM Size512kB
Number of I/O126
Operating Temperature-40°C ~ 125°C (TJ)
Core ProcessorARM® Cortex®-M4, C66x
ConnectivityCANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
PeripheralsDMA, POR, PWM, WDT
Supplier Device Package367-FCBGA (15x15)
ArchitectureDSP, MPU
Technical documentation
Product Overview
PROTOTYPE
0.475673s