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TDA4VM88TGBALF
TDA4VM88TGBALF

Texas Instruments
Brand
Bulk
Packaging
Batch
200
Stock
Product specifications
TYPEDESCRIPTION
MfrTexas Instruments
Series-
PackageBulk
Product StatusACTIVE
Package / Case827-BFBGA, FCBGA
Speed2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size1.5MB
Number of I/O226
Operating Temperature-40°C ~ 105°C (TJ)
Core ProcessorARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
ConnectivityMCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
PeripheralsDMA, PWM, WDT
Supplier Device Package827-FCBGA (24x24)
ArchitectureDSP, MCU, MPU
GradeAutomotive
QualificationAEC-Q100
Technical documentation
Product Overview
PROTOTYPE
0.342122s